Electronics Engineering Internship in Hyderabad at Connectsolar
Electronics Engineering
Connectsolar Private LimitedLocation(s): Hyderabad (Hybrid)Start DateImmediately
Duration4 Months
StipendRs. ₹ 8,000 - 15,000 /month
Posted On13 Sep '25
Apply By13 Oct' 25
DESCRIPTION
About the internship
Selected intern's day-to-day responsibilities include:
Work on a practical, end-to-end flow that you can hand to a design/operations team or an EMS (electronics manufacturing services)-
1. Electrical & Mechanical Design
a. System architecture schematic capture component selection (lifecycle, alternates) MCU/SoC + firmware plan enclosure/thermal design.
b. DFM/DFT: Choose packages manufacturable at target EMS; add test points; plan boundary-scan; design for automated assembly.
c. Outputs: Schematic, preliminary BoM with AVL/alternates, test strategy, enclosure CAD.
2. PCB Layout & Documentation
a. Tasks: Stackup with fab, impedance control, keepouts, panelization; add fiducials, tooling holes, labels/QR for traceability.
b. Outputs to manufacturer:
i. Fabrication: Gerbers/ODB++, drill files, stackup, impedance notes, soldermask, silkscreen, surface finish (e.g., ENIG/OSP), panel drawing.
ii. Assembly: Pick-and-place (XYRS/Centroid), paste/assembly drawings, BoM (with MPNs), programming specs, test procedures.
3. Prototype Build (EVT)
a. Fab steps: CAM lamination drilling plating imaging/etch soldermask finish silkscreen E-test rout.
b. SMT line: Solder paste print SPI pick-and-place reflow AOI X-ray for BGAs/QFNs selective rework.
c. Through-hole: Hand/wave/selective solder; staking where required.
d. Bring-up: Power sequencing, firmware flashing, basic functional test.
e. Outputs: Working prototypes, issues/defects list, updated BoM/layout.
4. Design Validation (DVT)
a. Tasks: Full feature verification, EMC pre-scan, safety review, thermal tests, reliability (vibe, drop, humidity), usability.
b. Outputs: DVT report, updated firmware, re-spin if needed, finalized test fixtures specs.
5. Process & Test Development
a. Fixtures: In-circuit test (ICT) bed-of-nails, boundary-scan, functional test (FCT), programming jigs, end-of-line (EOL) system test.
b. Work instructions: Assembly steps, torque specs, ESD controls (ANSI/ESD S20.20), cleaning, conformal coat/potting if used.
c. Outputs: Validated fixtures, golden units, control plan, traveler/routers.
6. Pilot Build (PVT/NPI)
a. Line setup: Stencil selection, reflow profile, feeder mapping, part kitting, MES/traceability setup (serials/UIDs).
b. Quality gates: Incoming inspection (AQL).
Work on a practical, end-to-end flow that you can hand to a design/operations team or an EMS (electronics manufacturing services)-
1. Electrical & Mechanical Design
a. System architecture schematic capture component selection (lifecycle, alternates) MCU/SoC + firmware plan enclosure/thermal design.
b. DFM/DFT: Choose packages manufacturable at target EMS; add test points; plan boundary-scan; design for automated assembly.
c. Outputs: Schematic, preliminary BoM with AVL/alternates, test strategy, enclosure CAD.
2. PCB Layout & Documentation
a. Tasks: Stackup with fab, impedance control, keepouts, panelization; add fiducials, tooling holes, labels/QR for traceability.
b. Outputs to manufacturer:
i. Fabrication: Gerbers/ODB++, drill files, stackup, impedance notes, soldermask, silkscreen, surface finish (e.g., ENIG/OSP), panel drawing.
ii. Assembly: Pick-and-place (XYRS/Centroid), paste/assembly drawings, BoM (with MPNs), programming specs, test procedures.
3. Prototype Build (EVT)
a. Fab steps: CAM lamination drilling plating imaging/etch soldermask finish silkscreen E-test rout.
b. SMT line: Solder paste print SPI pick-and-place reflow AOI X-ray for BGAs/QFNs selective rework.
c. Through-hole: Hand/wave/selective solder; staking where required.
d. Bring-up: Power sequencing, firmware flashing, basic functional test.
e. Outputs: Working prototypes, issues/defects list, updated BoM/layout.
4. Design Validation (DVT)
a. Tasks: Full feature verification, EMC pre-scan, safety review, thermal tests, reliability (vibe, drop, humidity), usability.
b. Outputs: DVT report, updated firmware, re-spin if needed, finalized test fixtures specs.
5. Process & Test Development
a. Fixtures: In-circuit test (ICT) bed-of-nails, boundary-scan, functional test (FCT), programming jigs, end-of-line (EOL) system test.
b. Work instructions: Assembly steps, torque specs, ESD controls (ANSI/ESD S20.20), cleaning, conformal coat/potting if used.
c. Outputs: Validated fixtures, golden units, control plan, traveler/routers.
6. Pilot Build (PVT/NPI)
a. Line setup: Stencil selection, reflow profile, feeder mapping, part kitting, MES/traceability setup (serials/UIDs).
b. Quality gates: Incoming inspection (AQL).
Skill(s) required
Circuit Design
Embedded Systems
Earn certifications in these skills
Who can apply
Only those candidates can apply who:
1. are available for full time (in-office) internship
2. can start the internship between 13th Sep'25 and 18th Oct'25
3. are available for duration of 4 months
4. have relevant skills and interests
* Women wanting to start/restart their career can also apply.
Perks
Certificate
Letter of recommendation
Flexible work hours
Informal dress code
5 days a week
Additional information
Stipend Structure:
Fixed pay: ₹ 5,000 - 10,000 /month
Incentive pay: ₹ 3,000 - 5,000 /month
Number of openings
6
About Connectsolar Private Limited
We are a leading 24/7 omnichannel customer service provider and call center based in India. Specializing in delivering exceptional support across multiple platforms, phone, email, chat, social media, and more, we ensure seamless, round-the-clock service for businesses globally. Our dedicated team of professionals is committed to enhancing customer experiences, driving satisfaction, and providing efficient solutions tailored to each client's unique needs. With a strong focus on quality and reliability, we help companies build stronger relationships with their customers, anytime, anywhere.
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